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Palomar Technologies
Establishment time : 1975
website : www.palomartechnologies.com
Main Product : Die attach, wire bonding, and vacuum reflow systems
Company Profile
Finetech
Establishment time : 1992
website : www.finetechusa.com
Main Product : Semiconductor packaging equipment
Company Profile
Hesse Mechatronics
Establishment time : Hesse Mechatronics was founded in 1998 and has since established itself as a leading provider of automated assembly systems.
website : www.hesse-mechatronics.com
Main Product : With a medium-sized workforce, Hesse Mechatronics has the capacity to handle projects of varying sizes and complexities.
Company Profile
Laizhou Jinlida Machinery Co.,Ltd
Company Profile
Besi
Establishment time : 1970
website : www.besi.com
Main Product : Semiconductor assembly equipment
Company Profile
West-Bond
Establishment time : West-Bond was founded in 1966.
website : www.westbond.com
Main Product : West-Bond specializes in wire bonders, die bonders, and other microelectronics assembly equipment.
Company Profile
K&S (Kulicke & Soffa)
Establishment time : K&S (Kulicke & Soffa) was founded in 1951 and has since become a leading provider of semiconductor packaging and electronic assembly equipment.
website :
Main Product : With a large company size, K&S serves customers in various industries across the globe.
Company Profile
ASM Pacific Technology
Establishment time : ASM Pacific Technology is a leading provider of semiconductor assembly equipment.
website :
Main Product : ASM Pacific Technology has a large global presence, serving customers in various markets.
Company Profile
Hybond
Establishment time : Hybond is a leading manufacturer of high-quality adhesives and sealants.
website :
Main Product : Our products are used in a wide range of applications, including automotive, construction, and electronics.
Company Profile
Micro Point Pro
Establishment time : Micro Point Pro was founded in 1983 and has been a leading provider of industrial markers and pens ever since.
website :
Main Product : With a medium-sized team, we are dedicated to delivering high-quality marking solutions to our customers.
Company Profile
December 13, 2023
Introducing the latest innovation in packaging technology - the Vertical Bonding Machine! This cutting-edge equipment is designed to streamline your production process and improve efficiency. Say...
Introducing our latest innovation - the Vertical Bonding Machine! This cutting-edge technology revolutionizes the bonding process, making it faster and more efficient than ever before. Say goodbye to...
The demand for vertical bonding machines has surged in the semiconductor industry due to the increasing need for advanced packaging solutions. Manufacturers are racing to develop more efficient and...
The foam pipe laminating extrusion machine consumer market is growing rapidly due to the demand for high-quality foam pipe products in various industries. Manufacturers are investing in advanced...
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December 13, 2023
September 09, 2024
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Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.